XENTRON Ultra Platform — Automotive Hardware & Firmware Engineering

Engineering overview

• XENCHECK and XENFLEET are two purpose-built devices developed under the same XENTRON Ultra hardware, firmware, security and vehicle-data engineering discipline.
• The XENCHECK Ultra datasheet verifies a triple-MCU architecture with Cortex-M7 at 550 MHz for vehicle networks and edge processing, Cortex-M33 at 250 MHz for security and DoIP, and Cortex-M0 for low-power Bluetooth 5.x.
• XENCHECK Ultra supports six simultaneous FDCAN interfaces or an operating option with four FDCAN interfaces plus 100BASE-T1 Automotive Ethernet, including UDS over DoIP.
• Its published security architecture includes TrustZone isolation, secure boot, hardware key and cryptographic engines, and signed, encrypted OTA firmware validation.
• One controlled hardware and firmware development loop from system architecture and circuit design to production release.
• Automotive PCB engineering typically uses six or more layers where required, with continuous ground-reference planes and application-dependent TG180-class materials.
• 50-ohm RF, microstrip, stripline, grounded coplanar waveguide, DDR timing, differential-pair skew, via-stub and backdrill design are handled in one signal-integrity process.
• Precision analog, ADC/DAC and sensor front ends are co-designed with low-noise references, Kelvin routing, decoupling, power integrity and EMI/EMC controls.